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MBRS3200T3G, NRVBS3200T3G
http://onsemi.com
2
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
V
RRM
RWM
VR
200
V
Average Rectified Forward Current (TL
= 150
°C)
IF(AV)
3.0
A
Non?Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
IFSM
100
A
Operating Junction Temperature
TJ
?65 to +175
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above t
he
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Value
Unit
Thermal Resistance, Junction?to?Lead (Note 1)
Thermal Resistance, Junction?to?Ambient (Note 2)
RJL
RJA
13
62
°C/W
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 3)
(IF
= 3.0 A, T
J
= 25
°C)
(IF
= 4.0 A, T
J
= 25
°C)
(IF
= 3.0 A, T
J
= 150
°C)
VF
0.84
0.86
0.59
V
Maximum Instantaneous Reverse Current (Note 3)
(Rated dc Voltage, TJ
= 25
°C)
(Rated dc Voltage, TJ
= 150
°C)
IR
1.0
5.0
mA
mA
1. Minimum pad size (0.108 ×
0.085 inch) for each lead on FR4 board.
2. 1 inch square pad size (1 ×
0.5 inch) for each lead on FR4 board.
3. Pulse Test: Pulse Width = 300 s, Duty Cycle ≤
2.0%.
100
1
0.1
0.2 0.3 0.4 0.5 0.6 0.7
0.8 0.9 1.1 1.31.0
1.2
VF, FORWARD VOLTAGE (V)
Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage
10
I
F
, FORWARD CURRENT (A)
TA
= 25
°C
TA
= 150
°C
100
1
0.1
0.2 0.3 0.4 0.5 0.6 0.7
0.8 0.9 1.1 1.31.0
1.2
VF, FORWARD VOLTAGE (V)
10
I
F
, FORWARD CURRENT (A)
TA
= 25
°C
TA
= 150
°C
TA
= 175
°C
TA
= 175
°C
TA
= 100
°C
TA
= 100
°C
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